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TEA1620P
STARplugTM
Rev. 01 -- 17 March 2004 Product data sheet
1. General description
The TEA1620P is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. It is implemented in the high voltage EZ-HVTM SOI process, combined with a low voltage BICMOS process. The device includes a high voltage power switch and a circuit for start-up directly from the rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a very efficient slim-line electronic power-plug concept possible. In its most basic version of application, the TEA1620P acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA1620P renders an efficient and low cost power supply system.
2. Features
s s s s s s s s s s s s s s Designed for general purpose supplies Integrated power switch: 48 and 650 V Operates from universal AC mains supplies: 80 V to 276 V Adjustable frequency for flexible design RC oscillator for load insensitive regulation loop constant Valley switching for minimum switch-on loss Frequency reduction at low power output for low standby power: <100 mW Adjustable overcurrent protection Undervoltage protection Temperature protection Short winding protection Safe restart mode for system fault conditions Simple application with both primary and secondary (opto) feedback Available in 8-pin DIP package.
3. Applications
s s s s Chargers Adapters TV and monitor standby supplies PC peripherals.
Philips Semiconductors
TEA1620P
STARplugTM
4. Quick reference data
Table 1: Symbol VCC(max) VDRAIN(max) IDRAIN RDSon Quick reference data Parameter maximum supply voltage maximum voltage at pin DRAIN supply current drawn from pin DRAIN drain-source on-state resistance Tj > 0 C no auxiliary supply ISOURCE = -0.06 A Tj = 25 C Tj = 100 C fosc Tamb oscillator frequency range ambient temperature 10 -20 48 68 55.2 78.2 200 +85 kHz C Conditions Min Typ 0.5 Max 40 650 Unit V V mA
5. Ordering information
Table 2: Ordering information Package Name TEA1620P DIP8 Description plastic dual in-line package; 8 leads (300 mil) Version SOT97-1 Type number
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
2 of 16
Philips Semiconductors
TEA1620P
STARplugTM
6. Block diagram
VCC
1
SUPPLY
8
DRAIN
VALLEY
TEA1620P
GND
2
LOGIC 100 mV
7
n.c.
PWM stop RC 3 OSCILLATOR THERMAL SHUTDOWN PROTECTION LOGIC POWER-UP RESET
1.8 U
6
SOURCE
low frequency
f
blank overcurrent
REG
4
2.5 V 10x short winding 0.75 V
0.5 V
5
AUX
col006
Fig 1. Block diagram.
7. Pinning information
7.1 Pinning
VCC GND RC REG
1 2 3 4
001aaa308
8
DRAIN n.c. SOURCE AUX
TEA1620P
7 6 5
Fig 2. Pin configuration.
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Product data sheet
Rev. 01 -- 17 March 2004
3 of 16
Philips Semiconductors
TEA1620P
STARplugTM
7.2 Pin description
Table 3: Symbol VCC GND RC REG AUX SOURCE n.c. DRAIN Pin description Pin 1 2 3 4 5 6 7 8 Description supply voltage ground frequency setting regulation input input for voltage from auxiliary winding for timing (demagnetization) source of internal MOS switch not connected drain of internal MOS switch; input for start-up current and valley sensing
8. Functional description
The TEA1620P is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and optocoupler feedback. The TEA1620P uses voltage mode control. The frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator. In the first case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it operates at a constant frequency, which can be adjusted with external components RRC and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses.
8.1 Start-up and undervoltage lock-out
Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin VCC passes the VCC(start) level. The supply is taken over by the auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efficiency operation. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time.
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Product data sheet
Rev. 01 -- 17 March 2004
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Philips Semiconductors
TEA1620P
STARplugTM
To ensure that the capacitor can be charged within the charge time, the value of the oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation voltage is equal to the external regulation voltage (minus 2.5 V) multiplied by the gain of the error amplifier (typical 20 dB or 10 x). The minimum duty factor of the switched mode power supply is 0 %. The maximum duty factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.4 Valley switching
A new cycle is started at the primary stroke when the switch is switched on (see Figure 3). After a certain time (determined by the RC oscillator voltage and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. After the secondary stroke, the drain 1 voltage shows an oscillation with a frequency of approximately ----------------------------2 x L p C p Where: Lp is the primary self inductance on the drain node Cp is the parasitic capacitance on the drain node. As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke. The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies. Figure 4 shows a typical curve for a reflected voltage N x Vo of 80 V. This voltage is the output voltage Vo (see Figure 5) transferred to the primary side of the transformer with the factor N (determined by the turns ratio of the transformer). Figure 4 shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33 before the valley. The switch-on losses are still reduced significantly.
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(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
5 of 16
Philips Semiconductors
TEA1620P
STARplugTM
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke A RC oscillator regulation level B
col007
A: Start of new cycle with valley switching. B: Start of new cycle in a classical PWM system.
Fig 3. Signals for valley switching.
40 phase () 20
001aaa311
0
-20
-40 0 200 400 600 f (kHz) 800
Reflected voltage at N x Vo = 80 V.
Fig 4. Typical phase of drain ringing at switch-on.
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
6 of 16
Philips Semiconductors
TEA1620P
STARplugTM
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the suppression time tsuppr, demagnetization recognition is suppressed. This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.
8.6 Protections
8.6.1 Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI (see Figure 5) to measure the current. The circuit is activated after the leading edge blanking time tleb. The protection circuit limits the source voltage to Vsource(max), and thus limits the primary peak current.
8.6.2 Short winding protection
The short winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short winding protection voltage Vswp, the TEA1620P stops switching. Only a power-on reset will restart normal operation. The short winding protection also protects in case of a secondary diode short circuit.
8.6.3 Overtemperature protection
An accurate temperature protection is provided in the TEA1620P. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared.
8.6.4 Overvoltage protection
Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level, or by keeping the level of pin AUX above Vdemag. The current primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into pin REG must be limited.
8.7 Characteristics of the complete power-plug
8.7.1 Input
The input voltage range comprises the universal AC mains from 80 V to 276 V.
8.7.2 Accuracy
The accuracy of the complete converter, functioning as a voltage source with primary sensing, is approximately 8 % (mainly dependent on the transformer coupling). The accuracy with secondary sensing is defined by the accuracy of the external components. For safety requirements in case of optocoupler feedback loss, the primary sensing remains active when an overvoltage circuit is connected.
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
7 of 16
Philips Semiconductors
TEA1620P
STARplugTM
8.7.3 Efficiency
An efficiency of 75 % at maximum output power can be achieved for a complete converter designed for universal mains.
8.7.4 Ripple
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 % under normal operating conditions, and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output current level, and the value and ESR of the output capacitor.
9. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Voltages VCC VRC VSOURCE VDRAIN Currents IREG IAUX IRC ISOURCE IDRAIN General Ptot Tstg Tamb Tj Vesd total power dissipation storage temperature ambient temperature junction temperature electrostatic discharge voltage human body model pin DRAIN all other pins machine model all pins
[1] [2] [3] [4] Pins VCC and RC are not allowed to be current driven. Pins REG and AUX are not allowed to be voltage driven. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 series resistor.
[4] [3]
Parameter supply voltage oscillator input voltage DMOS power transistor source voltage DMOS power transistor drain voltage regulation input current auxiliary winding input current oscillator capacitor charge current source current drain current
Conditions continuous
[1] [1]
Min -0.4 -0.4 -0.4 -0.4
Max +40 +3 +5 +650
Unit V V V V
[2] [2]
-10 -3 -0.25 -0.25
6 +5 +0.25 +0.25 1.0 +150 +85 +145 +1500 +2000 +200
mA mA mA A A W C C C V V V
Tamb < 45 C
-55 -20 -20 -1500 -2000 -200
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(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
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Philips Semiconductors
TEA1620P
STARplugTM
10. Thermal characteristics
Table 5: Symbol Rth(j-a)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1]
Typ 100
Unit K/W
Thermal resistance Rth(j-a) can be lower when pin GND is connected to sufficient copper area on the printed-circuit board. See the TEA152x application notes for details.
11. Characteristics
Table 6: Characteristics Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol Supplies Supply on pin VCC VCC(start) VCC(stop) ICC(operate) ICC(startup) ICC(ch) start voltage stop voltage operating supply current start-up supply current charging current undervoltage lock-out normal operation start-up VDRAIN > 60 V VCC = 0 V VCC = 8.5 V Supply on pin DRAIN IDRAIN supply current drawn from pin DRAIN no auxiliary supply with auxiliary supply; VDRAIN > 60 V Pulse width modulator mode min max Vdemag tsuppr minimum duty factor maximum duty factor demagnetization recognition voltage level time of suppression of transformer ringing at start of secondary stroke minimum voltage of RC oscillator setting maximum voltage of RC oscillator setting RC charging time oscillator frequency range input voltage on pin REG fosc = 100 kHz 50 1.0 0 75 100 1.5 150 2.0 % % mV s 0.5 30 125 mA A -650 -375 -520 -275 -390 -175 A A 9 7.0 9.5 7.5 1.3 180 10 8.0 1.9 400 V V mA A Parameter Conditions Min Typ Max Unit
Self oscillating power supply mode
Oscillator: pin RC VRC(min) VRC(max) tRC(ch) fosc VREG
9397 750 12577
60 2.4 10 2.4
75 2.5 1 2.5
90 2.6 200 2.6
mV V s kHz V
Duty factor regulator: pin REG
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
9 of 16
Philips Semiconductors
TEA1620P
STARplugTM
Table 6: Characteristics ...continued Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol GV(erroramp) VREG(clamp) dV/dtvalley fvalley td(valley-on) Parameter voltage gain of error amplifier clamping voltage on pin REG valley recognition ringing frequency for valley switching delay from valley recognition to switch-on drain leakage current drain breakdown voltage drain-source on-state resistance VDRAIN = 650 V Tj > 0 C ISOURCE = -0.06 A Tj = 25 C Tj = 100 C tdrain(f) drain fall time VDRAIN(switch_on) = 300 V; no external capacitor at pin DRAIN 48 68 75 55.2 78.2 ns N x Vo = 100 V IREG = 6 mA Conditions Min -102 200 Typ 20 550 150 Max 7.5 +102 800 Unit dB V V/s kHz ns
Valley switching recognition
Output stage (FET) IL(drain) VBR(drain) RDSon 650 125 A V
Temperature protection Tprot(max) Tprot(hys) Vsource(max) Vswp td(propagation) tleb maximum threshold temperature threshold temperature hysteresis overcurrent protection voltage short winding protection voltage delay from detecting Vsource(max) to switch-off leading edge blanking time dV/dt = 0.1 V/s dV/dt = 0.5 V/s dV/dt = 0.5 V/s both overcurrent and short winding protection 150 0.47 0.7 250 160 2 0.50 0.75 160 350 170 0.53 0.8 185 450 C C V V ns ns
Overcurrent and short winding protection: pin SOURCE
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
10 of 16
Philips Semiconductors
TEA1620P
STARplugTM
12. Application information
LF Z1 CF1 mains R1 R2 D2 CF2 D1 D5 C5 Vo
CVCC
VCC GND
1 2 3 4
8 7 6 5
DRAIN n.c. SOURCE AUX RI RAUX
C6 - Ycap
RRC RC R4 CRC R3 REG
TEA1620P
col008
Further application information can be found in the TEA152x application notes.
Fig 5. Application with primary sensing.
13. Test information
13.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
11 of 16
Philips Semiconductors
TEA1620P
STARplugTM
14. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 6. Package outline.
9397 750 12577 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
12 of 16
Philips Semiconductors
TEA1620P
STARplugTM
15. Soldering
15.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
15.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
15.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
15.4 Package related soldering information
Table 7: Package DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP [2]
[1] [2]
Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping suitable - Wave suitable [1] not suitable
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.
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Product data sheet
Rev. 01 -- 17 March 2004
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Philips Semiconductors
TEA1620P
STARplugTM
16. Revision history
Table 8: Revision history Release date 20040317 Data sheet status Product data Change notice Order number 9397 750 12577 Supersedes Document ID TEA1620P_1
9397 750 12577
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
14 of 16
Philips Semiconductors
TEA1620P
STARplugTM
17. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
20. Trademarks
STARplug -- is a trademark of Koninklijke Philips Electronics N.V. EZ-HV -- is a trademark of Koninklijke Philips Electronics N.V.
19. Disclaimers
Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or
21. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 17 March 2004
15 of 16
Philips Semiconductors
TEA1620P
STARplugTM
22. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.6.1 8.6.2 8.6.3 8.6.4 8.7 8.7.1 8.7.2 8.7.3 8.7.4 9 10 11 12 13 13.1 14 15 15.1 15.2 15.3 15.4 16 17 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Start-up and undervoltage lock-out . . . . . . . . . 4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 5 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Overcurrent protection . . . . . . . . . . . . . . . . . . . 7 Short winding protection . . . . . . . . . . . . . . . . . . 7 Overtemperature protection . . . . . . . . . . . . . . . 7 Overvoltage protection . . . . . . . . . . . . . . . . . . . 7 Characteristics of the complete power-plug . . . 7 Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application information. . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Quality information . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering by dipping or by solder wave . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15
(c) Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 17 March 2004 Document order number: 9397 750 12577
Published in The Netherlands

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